- The BCM43014 chip brings together novel innovations in sensor hub technology, audio DSP, and Bluetooth
- The new chip delivers a low but a robust power wireless audio experience in small form factor earbuds
Broadcom Inc., the U.S.-based semiconductor and infrastructure software solutions provider, has reportedly announced the launch of its BCM43014 chip that would enable the Samsung Galaxy Buds to deliver superior audio experience.
Reportedly, the BCM43014 chip has been engineered to meet the design obligations for in-ear wireless devices and has been built on Broadcom’s unique combination of wireless audio engineering and deep semiconductor expertise. It also enables flawless integration of advanced acoustic algorithms which lower background noise to deliver premium sound.
Vice President of Marketing for the Wireless Communications and Connectivity Division at Broadcom, Vijay Nagarajan was reportedly quoted saying that the company is delighted to have teamed up with Samsung for its Galaxy Buds. The BCM43014 chip is developed to deliver a low but a robust power wireless audio experience in small form factor earbuds and underlines the commitment of Broadcom to introduce high performance connectivity solutions to the smartphone industry, Nagarajan further added.
Sources familiar with the development claim that the BCM43014 chip brings together novel innovations in sensor hub technology, audio DSP, and Bluetooth. This rends rich audio while delivering up to five hours of voice calls or six hours of Bluetooth streaming, noted a press release issued by Broadcom.
Research Director of IDC, Phil Solis reportedly commented that Broadcom’s BCM43014 chip is the outcome of the company’s partnership with Samsung for the Galaxy Buds and is specifically designed for wireless earbuds. The combination of sensor hub processor, audio DSP, and Bluetooth 5 provides the integrated functionality in a tiny solution with low power consumption which is required for mobile accessories like Galaxy Buds, Solis explained.